返回主站 | 设为首页 | 加入收藏      
   
 
  首页 关于我们 产品展示 方案设计 技术分享 行业资讯 联系我们  
 
无线收发IC
2.4G无线收发IC
315MHz/433MHz无线遥控器发射接收IC
功放IC
电源管理IC
马达驱动IC/步进电机控制芯片
数模(DAC)/模数(ADC)转换芯片
智能处理器
音量控制IC
模拟开关IC
电容式触摸感应IC
RGB LED呼吸趣味灯驱动IC
音频CODEC IC
方案设计
电压电平转换器IC
运算放大器
I/O扩展器IC
 
名称:
种类:
类别:

业务洽谈:

联系人:张顺平 
手机:17727550196(微信同号) 
QQ:3003262363
EMAIL:zsp2018@szczkjgs.com

联系人:鄢先辉 
手机:17727552449 (微信同号)
QQ:2850985542
EMAIL:yanxianhui@szczkjgs.com

负责人联络方式:
手机:13713728695(微信同号) 
QQ:3003207580 
EMAIL:panbo@szczkjgs.com
联系人:潘波

 
当前位置:首页 -> 方案设计
SSM6322高保真低功耗立体声音频放大器解决方案
文章来源: 更新时间:2017/4/14 15:19:00
ADI公司的SSM6322是高保真低功耗立体声音频放大器,可直接和音频DAC/CODEC接口,具有杰出的音频性能和最小化功耗,从而延长手持设备电池寿命.1kHz时的THD+N为-121dB,输出电流100 mA rms,电源电压±3.3 V到±6 V,4 mm × 4 mm LFCSP封装,主要用在高保真耳机驱动器,手机,蓝牙扬声器和耳机,笔记本电脑和平板电脑A/V接收器,汽车娱乐系统.本文介绍了SSM6322主要特性,功能框图,以及评估板SSM6322CP-EBZ主要特性,电路图,材料清单和PCB设计图.
The SSM6322 is an integrated, dual-channel audio amp
lifiersolution that interfaces directly with audio DAC/CODEC,maximizing the fidelity of high fidelity audio signal chains. Thehighly efficient design of the SSM6322 delivers outstandingaudio performance while minimizing power dissipation formaximum battery life in portable applications.
The SSM6322 features −121 dB THD + N at 1 kHz, alongwith very low output noise from 20 Hz to 20 kHz. The low poweroperation, high peak output current, and high PSRR make theSSM6322 an ideal candidate for applications that require highfidelity audio, high dynamic range, precision, and low power. Thishighly integrated drive solution also reduces development timewhile reducing board space and minimizing external components.
The SSM6322 is available in a 24-lead LFCSP package. TheSSM6322 operates over the industrial temperature of −40℃ to+85℃.

SSM6322主要特性:
Flexible architecture to interface with all digital-to-analogconverters (DACs)
Accepts differential current or voltage input (providessingle-ended voltage output)
High output current drive capability
Greater than 100 mA rms output current
Accurately reproduces large music transients into heavyloads (16 Ω to 32 Ω)
Excellent audio fidelity
−121 dB total harmonic distortion plus noise (THD + N) at1 kHz, 2 V rms output with ±5 V supply and 32 Ω load
Low output integrated noise (10 Hz to 22 kHz) of1.8 μVrms with A-weighted filter
Supply range: ±3.3 V to ±6 V (typical)
Low power operation
Enabled: 60 mW, VCC = +5 V, VEE = −5 V
Disabled/voice select: <30 μA
Low power disable mode with high output impedance
High-Z in power-down mode eliminating voice modeswitch from the high fidelity path
Greater than 87 dB power supply rejection ratio (PSRR) at20 kHz
Adjustable input common-mode voltage with resistorprogrammable reference voltage
1.45 V (typical) with no external components
Capable of two single-pole, low-pass filters in series2.2 nF maximum input capacitor
Second filter between the GAINx and FILTx pins
Pop and click noise suppression
Signal chain integration supports small printed circuit board(PCB) area
Compact 4 mm × 4 mm LFCSP package

SSM6322应用:
High fidelity headphone drivers
Mobile phones
Bluetooth speakers and headphones
Gaming notebooks and tablets
A/V receivers
Professional audio equipment
Audio test equipment
Automobile infotainment systems

图1.功能框图

评估板SSM6322CP-EBZ
The SSM6322 evaluation board, the SSM6322CP-EBZ, evaluates the SSM6322, which is offered in a 24-lead LFCSP package. The SSM6322CP-EBZ evaluation board is a 4-layer printed circuit board (PCB) designed to quickly evaluate the performance of the device and reduce design time. The SSM6322CP-EBZ accepts SMA edge mounted connectors to test equipment or other circuitry.
Figure 1 shows the component side of the evaluation board, and Figure 2 shows the circuit side of the SSM6322CP-EBZ.
Complete specifications for the SSM6322 device are provided in the SSM6322 data sheet and should be consulted in conjunction with this user guide when using the evaluation board.

评估板SSM6322CP-EBZ主要特性:
Enables quick
prototyping
Edge mounted SMA connector provisions
Easy connection to test equipment and other circuits
±5 V and +3.3 V to supply the external circuit

图2.评估板SSM6322CP-EBZ外形图(正面)

图3.评估板SSM6322CP-EBZ外形图(背面)

图4.评估板SSM6322CP-EBZ电路图(1)

图5.评估板SSM6322CP-EBZ电路图(2)
评估板SSM6322CP-EBZ材料清单:


图6.评估板SSM6322CP-EBZ PCB设计图(1)

图7.评估板SSM6322CP-EBZ PCB设计图(2)

图8.评估板SSM6322CP-EBZ PCB设计图(3)

图9.评估板SSM6322CP-EBZ PCB设计图(4)

图10.评估板SSM6322CP-EBZ PCB设计图(5)
 
 
 
    相关产品  
 
深圳市永阜康科技有限公司 粤ICP备17113496号  服务热线:0755-82863877 手机:13242913995